We are seeking a top-tier cooling technology expert to lead innovation in data center cooling and future advanced thermal management. You will drive R&D of liquid cooling, CDU, high‑heat‑flux chip cooling, and next‑generation thermal technologies, supporting JCI global leadership in AI computing cooling.

What you will do:

1. Define and lead the technology roadmap for data center cooling and next‑generation advanced thermal management.

2. Architect and develop high‑power cooling solutions: direct liquid cooling, 2 phase liquid cooling, microchannel related, CDU (Cooling Distribution Unit), manifold, and immersion cooling systems.

3. Conduct high‑heat‑flux thermal design for AI chips, optimize thermal resistance, pressure drop, flow uniformity and heat dissipation performance.

4. Provide thermal & fluid simulation model guidelines or principles with system level cooling architecture.

5. Lead design, validation and mass production of CDU systems, including pumps, heat exchangers, valves, sensors and closed‑loop control logic.

6. Research and incubate future thermal technologies: two‑phase cooling, advanced coolants, smart thermal control, and low‑carbon cooling.

7. Drive system reliability: anti‑leakage, anti‑corrosion, anti‑condensation, material compatibility, FMEA and long‑term durability validation.

8. Collaborate with global customers, suppliers and partners (OCP, Intel, NVIDIA, cloud & hyperscale data centers) to define industry standards and solution specs.

9. Lead benchmarking activities by understanding advanced thermal management and liquid cooling technology trend

What we want:

1. Bachelor’s or above in Thermal Engineering, Fluid Mechanics, Mechanical Engineering, Refrigeration, Energy & Power Engineering or related; Master/Ph.D. preferred.

2. 8+ years of professional experience in data center cooling, server thermal management, liquid cooling systems or CDU development.

3. Deep expertise in: Direct chip liquid cooling (cold plate / microchannel) or CDU system design, integration and control or High‑heat‑flux thermal management for AI/GPU/CPU

4. Familiar with data center infrastructure, PUE optimization, cooling architecture and industry standards (ASHRAE, OCP, ODCC).

5. Proficient in 3D CAD (Creo/SolidWorks/Inventor) and thermal/fluid simulation tools.

6. Experience in forward-looking technology research and product roadmap planning is a strong plus.

7. Professional English working proficiency (reading, writing, communication); overseas experience is preferred.

8. Strong innovation, problem‑solving, project leadership and cross‑team collaboration.

What We Offer

• Competitive global compensation & bonus

• Cutting-edge R&D platform in liquid cooling & thermal management

• Clear career path for technical expert / management track

• Global project exposure and patent innovation platform

• Full benefits: insurance, housing allowance, meal allowance, paid leave

Preferred Qualifications

• Experience with AI computing, high‑density racks, or cloud data center customers.

• Hands‑on experience with advanced thermal management, liquid cooling / CDU systems.

• Knowledge of data center PUE, energy efficiency standards, and reliability design.

• Familiarity with IPD, agile, or stage‑gate NPD processes.

Competencies

• A positive attitude focused on understanding, anticipating and responding to the needs of the market and customers, both internal and external with Customer‑centric thinking

• Critical thinking skills adequate to understand risk and recommend options accordingly.

• Excellent communication skills and strong executive presence with Cross‑functional influence.

• Sense of urgency and ownership.

• Innovation and market sensitivity